Tabletop Wedge Wire Bonding Device "iBond5000"
Adjustable work holder height. Supports copper wire bonding. *24-hour online support available.
This product is an advanced tabletop wedge wire bonding (die bonding) device used for process development, manufacturing, research, and manufacturing support. It allows for Y-direction table movement settings via parameters, making bonding of pitch wires and parallel wires easy. Parameter import and export using USB is possible. 【Features】 ■ Supports copper wire bonding ■ Provides high yield and excellent reproducibility for bonding applications ■ Adjustable work holder height for improved flexibility ■ Ergonomically designed for ease of use *You can download the product documentation (PDF) from the link below.
- Company：Micro Point Pro ltd 本社
- Price：Other
